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1 caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. copyright intersil americas inc. 2012. all rights reserved. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a trademark owned by intersil corporation or one of its subsidiaries. all other trademarks mentioned are the property of their respective owners. application note 1789 isl8225meval2z 6-phase, 90a evaluation board setup procedure the isl8225m is a complete, dual step-down switching mode dc/dc module. the dual outputs can easily be paralleled for single-output, high-current use. it is easy to apply this high-power, current-sharing dc/dc power module to power-hungry datacom, telecom, and fpga applications. all that is needed in order to ha ve a complete, dual 15a design ready for use are the isl8225m, a few passive components, and v out setting resistors. the ease of use virtually eliminates design and manufacturing risks while dramatically improving time to market. need more output current? simply parallel up to six isl8225m modules to scale up to an 180a solution. the isl8225m has a thermally enhanced, compact qfn package that operates at full load and over-temperature without requiring forced-air cooling. easy access to all pins, with few external components, reduces pcb design to a component layer and a simple ground layer. the isl8225meval2z evaluation board allows for a single 6-phase paralleled output, which delivers high current up to 90a. the input voltage is 4.5v to 20v and the default output voltage on this board is set at 1.2v. the current level for this board is 90a with no extra cooling required. related resources recommended equipment ? 0v to 20v power supply with at least 10a source current capability ? electronic load capable of sinking current up to 90a (multiple electronic current loads can be used in parallel to sink more current) ? digital multimeters (dmms) ? 100mhz quad-trace oscilloscope quick start the inputs are j3 (vin) and j4 (gnd). the outputs are j1 and j5 (vout), j2 and j6 (gnd) and j6 (vout2). please refer to figure 1. this 90a evaluation board can be easily modified to 30a (one module) or 60a (two modules) operation. 1. connect a power supply capable of sourcing at least 10a to the input (vin j3 & gnd j4) of the isl8225meval2z evaluation board, with a voltage between 4.5v to 20v. connect an electronic load or the device to be powered to the output (vout (j1, j5) & gnd (j2, j6)) of the board. all connections, especially the low voltage, high current v out lines, should be able to carr y the desired load current and should be made as short as possible. duplicated tab connections on vout (j1, j5) and gnd (j2, j6) to carry large current. 2. ensure the jumpers for en2 and en3 are in the ?on? position and en is open. turn on the power supply. if the board is working properly, the green led will illuminate; if not, the red led will illuminate (recheck the wire/jumper connections in this case). measure the output voltage, v out , which should be at 1.2v. 3. the isl8225meval2z is manufactured with a v out default value of 1.2v; if different output voltages are desired, board resistors can be exchanged to provide the desired v out . please refer to table 1 on page 2 for r2/r64 resistor values, which can be used to produce different output voltages. see how-to video at intersil.com/ evid02 figure 1. isl8225meval2z board image load (0a~90a) v out 4.5v to 20v v in v + - note 1 + - v + - note: 1. multiple loads can be paralleled to reach 90a (i.e. two 45a loads paralleled together). december 3, 2012 an1789.0
application note 1789 2 an1789.0 december 3, 2012 for 12v v in and v out more than 1.5v, the switching frequency will need to be adjusted, as shown in table 1. the resistor r fset can be adjusted for the desired frequency. no frequency adjustments are necessary for v out below 1.5v. for 5v v in , the frequency does not need to be adjusted and the module default frequency can be used at any allowed v out . if the output voltage is set to more than 1.8v, the output current will need to be derated to allow for safe operation. please refer to the derating curves in the isl8225m datasheet . board setting if low current applications are needed, this 90a evaluation board can be easily programmed to 30a and 60a use. 30a application (1 module) en -- open, en2-- off, en3 -- off in this mode, only module 1 is running and modules 2 and 3 are disabled. 60a application (2 modules) en -- open, en2-- on, en3 -- off or: en -- open, en2-- off, en3 -- on in this mode, only modules 1 and 2 (or 3) are running and module 3 (or 2) is disabled. 90a application (3 modules) en -- open, en2-- on, en3 -- on in this mode, all modules are running. disable all modules and use the en pin to start the modules en -- connected in this mode, all modules are disabled and en can be used to control all modules to startup. evaluation board information the evaluation board size is 150mm x 130mm. it is a 6-layer board, containing 2-ounce copper on the top and bottom layers and 1-ounce copper on all internal layers. the board can be used as a 90a reference design. refer to the ?layout? section beginning on page 7. the board is made of fr4 material and all components, including the sold er attachment, are lead-free. current sharing check the evaluation board allows the user to measure the current sharing accuracy. four zero ohm resistors (i.e. r59~r62 for m1 channel 2 in figure 2) are put serially on each output with two on each side of the evaluation board. to measure the output current of each phase, please remove al l four resistors and put looped wires or sensing resistors on correct positions. although the assembled resistors have zero resistance, there is still small resistance (< 50m ? ) on each resistor. at large output current, the efficiency can be decreased by 1~3% due to the power loss on those zero ohm resistors. the efficiency curves are shown in figures 16 and 17 with zero ohm resistors, while figures 18 and 19 show the efficiency curves by replacing those resistors with short copper straps. thermal considerations and current derating for high current applications, board layout is very critical in order to make the module operate safely and deliver maximum allowable power. to carry large currents, the board layout needs to be designed carefully to maximize thermal performance. to achieve this, select enough trace width, copper weight and the proper connectors. this evaluation board is design ed for running 90a @ 1.2v at room temperature without additi onal cooling systems needed. however, if the output voltage is increased or the board is operated at elevated temperatures, then the available current is derated. refer to the derated current curves in the datasheet to determine the output current available. for layout of designs using the isl8225m, the thermal performance can be improved by adhering to the following design tips: 1. use the top and bottom layers to carry the large current. vout1, vout2, phase 1, phase 2, pgnd, vin1 and vin2 should have large, solid planes. place enough thermal vias to connect the power planes in different layers under and around the module. 2. phase 1 and phase 2 pads are switching nodes that generate switching noise. keep these pads under the module. for noise-sensitive applications, it is recommended to keep phase pads only on the top and inner layers of the pcb; do not place phase pads exposed to the outside on the bottom layer of the pcb. to improve the thermal performance, the phase pads can be extended in the inner layer, as shown in phase 1 and 2 pads on layer 3 (figure 11) for this 90a evaluation board. make sure that layer 2 and layer 4 have the gnd layers to cover the extended areas of phase pads at layer 3 to avoid noise coupling. table 1. value of bottom resistor for different output voltages (r1 = 1k) v out (v) r2 /r64 ( ? ) frequency (khz) r fset ( ? ) (v in = 12v) 0.6 0/0 default default 0.8 3010/1500 default default 1.0 1500750 default default 1.2 1000/500 default default 1.5 665/332 default default 2.5 316/158 650 249k 3.3 221/110 800 124k 5.0 137/68.1 950 82.5k 5.5 121/60.4 950 82.5k
application note 1789 3 an1789.0 december 3, 2012 3. to avoid noise coupling, we recommend adding 1nf capacitors on all comp and ishare pins of each module for multiple module operations. 4. place the modules evenly on the board and leave enough space between modules. if the board space is limited, try to put the modules with low power loss closely together (i.e. low v out or i out ) while still separating the module with high power loss. 5. if the ambient temperature is high or the board space is limited, airflow is needed to dissipate more heat from the modules. a heat sink can also be applied to the top side of the module to further improve the thermal performance (heat sink recommendation: aavid thermalloy, part number 375424b00034g, www.aavid.com ). remote sensing the isl8225meval2z board allows the user to apply the remote sensing function to loads in order to achieve good output regulation accuracy. to make use of this function, remove resistors r7 and r8 and connect the kelvin sensing lines through the jumper jp4 (rs) to the point of load. phase-shift programming in current sharing mode, the phase-shift is needed to interleave the different phases to lower the input and output ripples. as shown in table 2, there are different sharing modes from 2-phase (180 phase-shift) and 4-phase (90 phase-shift) to 6-phase (60 phase-shift). the master module sends the clkout signal to the sync pin of the second module with the phase-shift to its own clock signal. then the second module synchronizes to the clkout signal of the master module and sends its clkout signal to the third module?s sync pin. the individual 2 phases of each module are set to be 180 phase-shift by default. this evaluation board is set to mode 5b with 60 phase-shift between phases. if the mode pin is not tied to vc c (5a or 5b), all vmon pins of different modules can be tied together, except the vmon pin of the master phase. if mode 7a is needed to allow for 90 phase-shift, the mode pin has to tie to vcc. in this case, the vmon pin of the associated module needs to be separated by connecting a 1.05k ? resistor to sgnd, as shown in the isl8225m datasheet . table 2. isl8225m 3-module board operation modes 1 st module (i = input; o = output; i/o = input and output, bi-direction) modes of operation output operation mode of 2 nd module operation mode of 3 rd module mode en2 (i) en3 (i) vsen2- (i) mode (i) vsen2+ (i) clkout/refin wrt 1 st (i or o) ishare (i/o) represents which channel(s) current 2 nd channel wrt 1 st (o) 5a 0 0 v cc gnd - 60 both channels 180 - - 2-phase 5b 1 1 v cc gnd - 60 both channels 180 5b 5b 6-phase 7a 1 0 v cc v cc v cc 90 both channels 180 5a or 7a - 4-phase 8 cascaded module operation modes 5a+5a+7a+5a+5a +5a/7a, no external clock required 12-phase
application note 1789 4 an1789.0 december 3, 2012 isl8225meval2z board schematics figure 2. isl8225meval2z board schematic 4.5v to 20v gnd gnd en rs gnd gnd 1.2v @ 90a + - sgnd1 11/01/2012 47uf open open 47uf 08/23/2012 ishare gnd_s1 egnd vmon dnp 1000pf 100pf dnp dnp 0 0 d v1sen2+ ISL8225MIRZ 22uf phase2u1 vout 1000pf vin vcc1 open open vcc1 1000pf 1k phase1u1 comp 0 1000pf 0 vcc1 clkout1 v1sen2+ 22uf 0 dnp 0 dnp tim klemann jian yin isl8225meval2z evaluation board schematic isl8225m 470uf 22uf comp 1000pf 0 0 vout 499 vcc1 1k mode1 vcc1 0 open 0 3k 0 0 0 dnp 3.32k pgood open vout sync sync 0 open 1k 0.01uf 330uf 0 mode1 vcc1 0 4.7uf vout dnp pgood 330uf 0 1000pf 499 vout 1000pf vin 470uf vmon 100pf vin 22uf 3.32k en/ff ssl_lxa3025igc 2n7002-7-f sync 249k tim klemann open vsen2- vsen1- vsen2+ vsen1+ pgood in in in in in in in in in in in out out out out out out out in out out in out in en/ff1 en/ff2 clkout vmon1 ishare comp1 vout2 26 25 24 23 22 21 12 11 10 1 1 pgnd vin1 n/c red grn mode sgnd sync vmon2 comp2 vout1 vcc tp8 tp7 tp10 tp9 tp4 r9b tp1 released by: drawn by: sheet hrdwr id date: date: date: tester filename: mask# rev. date: engineer: title: updated by: e e e pgnd vin2 s3 e s1 e s3 e s1 s1 s1 s1 s1 s1 s1 s1 s1 s1 s1 s1 e s1 e e e in 23 4 2 3 1 20 19 18 17 16 15 14 13 9 8 7 6 5 4 3 2 phase1 phase2 c40 rfset q1 tp5 tp6 tp3 r62 r59 r60 r61 j4 j2 j6 j5 j1 j3 cinb cina c02 c01 c06 c05 c11 r6 r5 jp4 c19 c29 r10 r14 c32 r10b c08a c7 c6 cin4 cin3 cin1 cin2 r56 jp8 c18 c08 c04 c07 c03 r18 c4 r47 c10 c5 r13 r7 r8 c12 r64 r2 r9 c35 r1 r82 r39 r53 r38 r40 c8 r22 r16 r15 led1 r12 r42 c1 r11 m1
application note 1789 5 an1789.0 december 3, 2012 figure 3. isl8225meval2z board schematic isl8225meval2z board schematics (continued) sgnd2 off en2 on 11/01/2012 tim klemann 47uf open 47uf open 08/23/2012 vmon1 0 0 pgood v2sen2+ ISL8225MIRZ clkout1 0 0 vcc2 vcc2 1000pf 100pf 0 dnp dnp phase1u2 dnp 22uf 0 0 0 0 0 v2sen2+ dnp open dnp dnp open open dnp dnp 1000pf 0 tim klemann isl8225m evaluation board jian yin schematic vcc2 ishare open vout 330uf 0 mode2 1000pf phase2u2 4.7uf gnd_s2 0 vmon1 0 0 100pf 0 open dnp open clkout2 0 vmon dnp 0 comp mode2 egnd comp2 open 1000pf 1000pf vcc2 en/ff 0 open 47uf comp2 22uf 22uf 22uf vin vcc2 vsen2- vsen1- vsen2+ vsen1+ pgood out in in in out in out in out out in out out out out in out out in in out en/ff1 en/ff2 clkout vmon1 ishare comp1 vout2 26 25 24 23 22 21 12 11 10 1 3 2 1 pgnd vin1 n/c mode sgnd sync vmon2 comp2 vout1 vcc released by: drawn by: hrdwr id date: date: date: tester mask# rev date: engineer: title: updated by: e e e e e pgnd vin2 s2 s2 e e s2 s2 s2 s2 s2 s2 s2 s2 s2 s2 s2 s2 in 20 19 18 17 16 15 14 13 9 8 7 6 5 4 3 2 phase1 phase2 c010 c09 c013 c012 c0 r20 r20b c25 c42 c26 c30 c36 r28 c33 r25 c13 c14 cin8 cin7 cin6 cin5 r57 r49 c17 c15 r19 c16 c011 c016 c015 r27 j8 r4 r87 r86 r3 c47 r28b r70 r66 r69 r65 r72 r67 r71 r68 r45 r52 r35 r54 r17 r48 c2 c37 r43 r23 m2
application note 1789 6 an1789.0 december 3, 2012 figure 4. isl8225meval2z board schematic isl8225meval2z board schematics (continued) en3 on off tim klemann 11/01/2012 08/23/2012 clkout2 vcc3 dnp dnp clkout3 vcc3 dnp 22uf 22uf vcc3 330uf vout 0 0 0 22uf open 1000pf 47uf vcc3 open dnp v3sen2+ clkout3 en/ff vin dnp egnd mode3 0 1000pf 1000pf 0 0 0 phase2u3 0 0 open 22uf vmon1 phase1u3 0 0 comp2 gnd_s3 open clkout3 4.7uf dnp 0 100pf 0 1000pf tim klemann jian yin schematic isl8225m comp3 dnp dnp open ishare evaluation board 0 dnp mode3 0 0 open open vmon2 0 comp3 1000pf vcc3 vmon2 100pf ISL8225MIRZ v3sen2+ pgood open open 47uf vsen2- vsen1- vsen2+ vsen1+ pgood out in in in in in in out out in in in out out out out out in out out out in en/ff1 en/ff2 clkout vmon1 ishare comp1 vout2 26 25 24 23 22 21 12 11 10 1 3 2 1 pgnd vin1 n/c mode sgnd sync vmon2 comp2 vout1 vcc tp11 tp2 released by: drawn by: hrdwr id date: date: date: tester mask# rev. date: engineer: title: updated by: s3 s3 s3 s3 s3 s3 e e e e e pgnd vin2 s3 e s3 e s3 s3 s3 s3 s3 s3 in 20 19 18 17 16 15 14 13 9 8 7 6 5 4 3 2 phase1 phase2 r80 r76 r79 r75 c014 c27 c28 r31 c34 r37b c31 c44 r30 c20 c21 r58 r51 cin12 cin11 cin10 cin9 c9 c24 r26 c23 c22 r37 c019 c024 c023 c021 c017 c018 r21 r50 r44b j7 r81 r78 r74 r77 r73 r46 c3 r55 r24 r29 c39 r44 r33 r36 m3
application note 1789 7 an1789.0 december 3, 2012 layout figure 5. top assembly figure 6. top silk screen figure 7. top layer component side figure 8. layer 2 off on
application note 1789 8 an1789.0 december 3, 2012 figure 9. layer 3 figure 10. layer 4 figure 11. layer 5 figure 12. bottom layer solder side layout (continued)
application note 1789 9 an1789.0 december 3, 2012 figure 13. bottom silk screen figu re 14. bottom silk screen mirrored figure 15. bottom assembly layout (continued)
application note 1789 10 an1789.0 december 3, 2012 bill of materials part number ref des qty. value tol. voltage power package type jedec type manufacturer description 10tpb330m c04, c08, c016, c024, c08a 5 330f 20% 10v smd cap_7343_149 sanyo-poscap standa rd solid electrolytic chip tantalum smd capacitor 131-4353-00 tp1 1 conn tek131-4353-00 tektronix scope probe test point pcb mount 2n7002-7-f q1 1 sot23 sot23 fairchild n-channel emf effect transistor (pb-free) 5002 tp2-tp11 10 thole mtp500x keystone miniature white test point 0.100 pad 0.040 thole eca-1vm471 cina, cinb 2 470f 20% 35v radial capr_708x 1398_300_p panasonic radial capacitor pb-free grm21br71c475ka73l c1-c3 3 4.7f 10% 16v 805 cap_0805 murata ceramic capacitor grm32er70a476k c0, c02, c05, c010, c013, c014, c018 7 47f 10% 10v 1210 cap_1210 murata ceramic chip capacitor grm32er71e226ke15l cin1-cin12 12 22f 10% 25v 1210 cap_1210 murata ceramic chip capacitor h1045-00101-50v10 c6, c7, c13, c14, c20, c21 6 100pf 10% 50v 603 cap_0603 generic multilayer capacitor h1045-00102-16v10 c8 1 1000pf 10% 16v 603 cap_0603 generic multilayer capacitor h1045-00102-50v10 c4, c5, c9, c11, c16-c19, c23-c31, c40 18 1000pf 10% 50v 603 cap_0603 generic multilayer capacitor h1045-00103-50v10 c35 1 0.01f 10% 50v 603 cap_0603 generic multilayer capacitor h1045-open c10, c12, c15, c22, c32-c34, c36, c37, c39, c42, c44, c47 13 open 5% open 603 cap_0603 generic multilayer capacitor h1082-open c01, c03, c06, c07, c09, c011, c012, c015, c017, c019, c021, c023 12 open 10% open 1210 cap_1210 generic ceramic chip capacitor h2505-dnp-dnp-1 r3, r4, r13-r17, r20, r21,r24, r25, r28-r31, r37, r48, r50, r51, r56-r58, r86, r87, r10b, rfset 26 dnp 1% dnp 603 res_0603 generic metal film chip resistor (do not populate)
application note 1789 11 an1789.0 december 3, 2012 h2511-00r00-1/16w1 r7-r10, r18, r19, r22, r23, r26, r27, r33, r35, r36, r42-r47, r49, r52, r54, r55, r81, r9b, r20b, r28b, r37b, r44b 29 0 ? 1% 1/16w 603 res_0603 generic thick film chip resistor h2511-01001-1/16w1 r1, r2, r6 3 1k ? 1% 1/16w 603 res_0603 generic thick film chip resistor h2511-03321-1/16w1 r11, r12 2 3.32k ? 1% 1/16w 603 res_0603 generic thick film chip resistor h2511-04990-1/16w1 r64, r82 2 499 ? 1% 1/16w 603 res_0603 generic thick film chip resistor h2520-00r00-1/2w5 r38-r40, r53, r59-r62, r65-r80 24 0 ? 5% 1/2w 2010 res_2010 generic thick film chip resistor ISL8225MIRZ m1-m3 3 qfn qfn26_670x670_isl8225m in tersil dual 15a dc/dc power module jumper-3-100 j7, j8 2 thole jump er-3 generic three pin jumper jumper2_100 jp4, jp8 2 thole jumper-1 generic two pin jumper kpa8ctp j1-j6 6 conn kpa8ctp burndy wire connector lug mcr03ezpfx3001 r5 1 3k ? 1% 1/10w 603 res_0603 rohm metal film chip resistor ssl-lxa3025igc led1 1 smd led_3x2_5mm lumex 3mmx2.5mm surface mount red/green led note: 2. resistance accuracy of the feedback resistor divider r1/r2 can affect the output voltage accuracy. please use high accuracy r esistance (i.e. 0.5% or 0.1%) to meet the output accuracy requirement. bill of materials (continued) part number ref des qty. value tol. voltage power package type jedec type manufacturer description
application note 1789 12 intersil corporation reserves the right to make changes in circuit design, software and/or specifications at any time without n otice. accordingly, the reader is cautioned to verify that the application note or technical brief is current before proceeding. for information regarding intersil corporation and its products, see www.intersil.com an1789.0 december 3, 2012 isl8225meval2z efficiency curves test conditions at +25c and no air flow. efficiency curves with zero-ohm resistance on the output figure 16. efficiency curves for 12v input f igure 17. efficiency curves for 5v input 55 65 75 85 95 0 10 20 30 40 50 60 70 80 90 100 load current (a) efficiency (%) 1v out 1.2v out 1.5v out 3.3v out 2.5v out 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100 1v out 1.2v out 1.5v out 3.3v out 2.5v out load current (a) efficiency (%) efficiency curves by replacing zero-o hm resistance with thick copper strap figure 18. efficiency curves for 12v input f igure 19. efficiency curves for 5v input 55 65 75 85 95 0 10 20 30 40 50 60 70 80 90 100 load current (a) efficiency (%) 1v out 1.2v out 1.5v out 3.3v out 2.5v out 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100 load current (a) efficiency (%) 1v out 1.2v out 1.5v out 2.5v out

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